Ormecon introducing ultrathin new Organic Nanometal * Surface finish in commercial scale * First industrial line being installed in Korea

Hamburg (Germany) 26 September (PROTEXT/ots) - A completely new nano sizesurface finish is introduced by Ormecon International into the PrintedCircuit Board market. The thickness is only 55 nanometres, the layerconsists of a nanoparticle complex formed between the Organic Nanometal andSilver (the Silver only contributes up less than 10% to it).

Nonetheless, this ultrathin layer provides a much more powerful oxidationprotection and solderability preservation than any other establishedmetallic finish - although the established finishes are between 6 and 100times thicker than this new nanofinish.

According to Ormecon, several tests in many companies in the electronicsindustry have already shown a superior thermal resistance and perfectsolderability.

Only three months after the first public presentation by Dr. BernhardWessling, the inventor and Ormecon CEO in July 2007, a first industrialline for the deposition of the new nanofinish will be installed in Korea atOrmecon’s customer YooJin. The line will go into operation in the secondhalf of October.

It will be the first commercial line to provide a nano sized surface finishfor printed circuit boards.

The energy consumption will only be 10 - 30%, the total environmentalresource consumption is less than 1% compared to conventional surfacefinish processes.

More information is available on Ormecon’s websitehttp://www.ormecon-nanotech.com.

Background information:

Printed Circuit Boards (PCB) are the basis for any electronic control incomputers, mobile phones, printers, TVs, and of all electric and electroniccontrol tasks in cars, airplanes, satellites, elevators, dish washer,washing machines, refrigerators and even modern coffee machines.

Chips and other electronic components are being fixed (soldered) on definedlocations on the printed circuit board, and the board contains the circuitby which the components are connected with each other.

The manufacturing of the fully functioning PCB is separated in theindustry, first, the PCB manufacturer produces the bare board with thecircuit, then the so-called “assembler” puts the electronic components onthe boards and fixes them firmly by soldering.

This positioning and soldering process is fully automatic, is running forseveral times at peak temperatures or around 260 °C and therefore requiresa 100% guarantee that every of the many 100 partially microscopically smallCu locations will accept the solder and form a connection which is stablefor many years even under temperature changes between low arctic or evenlower space temperature, up to high operating temperatures like 80 or 150°C close to motors or within a laptop, regardless whether under constantvibrations (like in a car or airplane) or not.

Therefore, the final surface finish is the most critical step on the PCBmanufacturing, and the new Nanofinish is promising to revolutionize surfacefinishing of PCBs.

Ormecon International is a small internationally operating group companies,founded by Dr. Bernhard Wessling who discovered and introduced the newnanomaterial class of Organic Metals.

Contact Information:

Dr. Bernhard Wessling, Ormecon GmbH

E-mail: wessling@ormecon.de

Phone: +49-40-60410618

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